| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6947466 | Microelectronics Reliability | 2011 | 5 Pages |
Abstract
⺠We tested warpage variations of Si/solder/OFHC-Cu layered plates subjected to cyclic thermal loading. ⺠We used two solders, fully annealed and as-received Cu plates, and three thickness ratios of the Si and Cu layers. ⺠Either the cyclic growth or the cyclic recovery of warpage occurred in the layered plates. ⺠The cyclic growth/recovery of warpage was simulated well using appropriate material models in FE analysis.
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Authors
Hisashi Tanie, Kazuhiko Nakane, Yusuke Urata, Masatoshi Tsuda, Nobutada Ohno,