Article ID Journal Published Year Pages File Type
6947472 Microelectronics Reliability 2011 5 Pages PDF
Abstract
This paper presents the insulated TO-220AB TRIAC package aging when these devices are subjected to experimental power cycling test with various case temperature swings (ΔTcase). This study includes reliability tests set-up, results and failure analysis. An innovative failure analysis flow is proposed to identify the failure mechanism implied. This new failure analysis process flow is necessary due to the complex stack of these devices. Finally, thanks to the reliability tests and the complete failure analysis results, the thermal resistance (Rth) change is correlated to the physical defect modification. This whole study gives the first data collection that is required to propose a lifetime prediction model for insulated TO-220AB TRIAC package during power cycling accelerated aging tests.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
Authors
, , , , ,