| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6947507 | Microelectronics Reliability | 2011 | 6 Pages |
Abstract
⺠This work presents an analytical approach to optimize the power wire connection. ⺠An analytic model provides the temperature field into the wire connection. ⺠A thermo-mechanical model calculates the wire expansion and the loop height variation. ⺠The models has been compared with experimental results with a good agreements.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Y. Celnikier, L. Dupont, E. Hervé, G. Coquery, L. Benabou,