| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6947513 | Microelectronics Reliability | 2011 | 5 Pages |
Abstract
⺠This paper is an overview about the reliability prediction of high power IGBTs. ⺠The failure mechanisms of wire-bonded and press-pack IGBTs are reviewed. ⺠The most commonly used lifetime prediction models are reviewed. ⺠So far most of the reliability research was focused on wire-bonded IGBTs. ⺠More research is needed about the reliability prediction of press-pack IGBTs.
Related Topics
Physical Sciences and Engineering
Computer Science
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Authors
C. Busca, R. Teodorescu, F. Blaabjerg, S. Munk-Nielsen, L. Helle, T. Abeyasekera, P. Rodriguez,