| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6947515 | Microelectronics Reliability | 2011 | 6 Pages |
Abstract
⺠A design approach to improve the thermal performance of power devices is presented. ⺠Improved thermal management due to an optimization of the bond wire positions. ⺠2D electrical simulations evaluate lateral power distributions. ⺠3D thermal finite element simulation is compared to IR thermography measurements. ⺠Single pulse short-circuit testing state an improved device robustness.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Helmut Köck, Christian Djelassi, Stefano de Filippis, Robert Illing, Michael Nelhiebel, Markus Ladurner, Michael Glavanovics, Dionyz Pogany,