Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7741271 | Journal of Power Sources | 2013 | 6 Pages |
Abstract
⺠Addition of inorganic binder to SOFC contact materials enhances bonding. ⺠Enhanced bonding after low-temperature cure. ⺠Acceptably low ASR achieved for select binder compositions.
Related Topics
Physical Sciences and Engineering
Chemistry
Electrochemistry
Authors
Michael C. Tucker, Lei Cheng, Lutgard C. DeJonghe,