Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7742469 | Journal of Power Sources | 2012 | 8 Pages |
Abstract
⺠A thermo-mechanical fatigue testing technique for SOFC interconnect is developed. ⺠A fatigue mechanism involving cyclic plasticity dominates non-hold-time TMF life. ⺠Non-hold-time TMF life is increased with a decrease in applied stress at 800 °C. ⺠A 100-h hold-time of applied stress at 800 °C significantly reduces TMF life. ⺠Both creep and creep-fatigue interaction contribute to the hold-time TMF damage.
Keywords
Related Topics
Physical Sciences and Engineering
Chemistry
Electrochemistry
Authors
Yung-Tang Chiu, Chih-Kuang Lin,