| Article ID | Journal | Published Year | Pages | File Type | 
|---|---|---|---|---|
| 7742469 | Journal of Power Sources | 2012 | 8 Pages | 
Abstract
												⺠A thermo-mechanical fatigue testing technique for SOFC interconnect is developed. ⺠A fatigue mechanism involving cyclic plasticity dominates non-hold-time TMF life. ⺠Non-hold-time TMF life is increased with a decrease in applied stress at 800 °C. ⺠A 100-h hold-time of applied stress at 800 °C significantly reduces TMF life. ⺠Both creep and creep-fatigue interaction contribute to the hold-time TMF damage.
											Keywords
												
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													Physical Sciences and Engineering
													Chemistry
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											Authors
												Yung-Tang Chiu, Chih-Kuang Lin, 
											