| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 9672138 | Microelectronics Reliability | 2005 | 6 Pages |
Abstract
This paper proposes several examples where this problem has been solved by proper analysis of the stresses, by dedicated physical modeling, and by efficient calculation tools.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Mauro Ciappa,