| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 9672201 | Microelectronics Reliability | 2005 | 6 Pages |
Abstract
This paper presents our effort to predict delamination related IC & packaging reliability problems. These reliability problems are driven by the mismatch between the different material properties, such as thermal expansion, hygro-swelling, and/or the degradation of interfacial strength. First of all, a test technique is presented to measure the interfacial strength between packaging materials. Secondly, several reliable non-linear Finite Element models are developed, able to predict the reliability impact of delamination on wire failures, different package structures, and passivation cracks in IC-packages.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
W.D. van Driel, M.A.J. van Gils, R.B.R. van Silfhout, G.Q. Zhang,