Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9672226 | Microelectronics Reliability | 2005 | 6 Pages |
Abstract
This paper reports on the investigation of the failure mechanism in capacitive RF-MEMS through an efficient analysis methodology. We demonstrate that the physical origin of the dielectric charging is the leakage current through the RF-MEMS dielectric. To monitor the kinetic of this failure phenomenon, we introduce a useful parameter, which corresponds to the shift rate of the actuation voltages (SRAV) and an appropriate reliability-driven electrical stress parameter, which takes the contact quality between the bridge and the dielectric into account. We finally propose a figure of merit, derived from a predictive model, which quantifies the capacitive RF MEMS reliability and open the door to the prediction of lifetime as well as its optimization and/or acceleration for testing.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
S. Mellé, D. De Conto, L. Mazenq, D. Dubuc, B. Poussard, C. Bordas, K. Grenier, L. Bary, O. Vendier, J.L. Muraro, J.L. Cazaux, R. Plana,