Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9672296 | Microelectronics Reliability | 2005 | 4 Pages |
Abstract
Experiments were performed on 2.3Â nm thin gate oxides. The interface state density and the low voltage stress induced leakage current are compared after uniform and localized stresses. The energy distribution of interface state density in the bandgap is then determined. The normalized variations of interface state density and gate leakage current are shown to be comparable after localized stress but completely different after uniform stresses.
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Authors
D. Zander,