Article ID Journal Published Year Pages File Type
9672296 Microelectronics Reliability 2005 4 Pages PDF
Abstract
Experiments were performed on 2.3 nm thin gate oxides. The interface state density and the low voltage stress induced leakage current are compared after uniform and localized stresses. The energy distribution of interface state density in the bandgap is then determined. The normalized variations of interface state density and gate leakage current are shown to be comparable after localized stress but completely different after uniform stresses.
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Physical Sciences and Engineering Computer Science Hardware and Architecture
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