Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9952387 | Microelectronics Reliability | 2018 | 8 Pages |
Abstract
Transient liquid phase (TLP) bonding is a potential joining technology for high-temperature power electronics packaging. In this study, the thermal reliability of Ag-Sn TLP bond was investigated through high-temperature storage test, in which the relationship between microstructure evolution and mechanical property was developed during 350â¯Â°C aging. After aging for 120â¯h, the Ag3Sn or ζ phase within the joint evolved totally into Ag(Sn) solid solution, which fractured with a ductile characteristic during shear test. The Ag-Sn TLP bond was confirmed to operate at ambient temperature of 350â¯Â°C for nearly 1000â¯h without serious failure, still possessing high shear strength of about 40â¯MPa. During thermal aging, a great amount of irregular Ni-Sn intermetallic particles were precipitated and dispersed adjacent to the interface between the Cu substrate and the Ag-Sn phases once the Ag metallization layer was consumed entirely. Moreover, a relatively thick Ni buffer layer should be carefully considered to prevent continuous cracks propagating along the Cu/Ag(Sn) interface, which was induced by the significant outflow of Cu flux from the interfacial zone, like a Kirkendall voiding process.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Huakai Shao, Aiping Wu, Yudian Bao, Yue Zhao, Guisheng Zou, Lei Liu,