| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 9952390 | Microelectronics Reliability | 2018 | 19 Pages |
Abstract
Finally, for Sn96.5Ag3.0Cu0.5 solder alloy the ability of the different material formulations to reproduce trends of measured force-displacement hysteresis was analyzed: for double power-law creep model (DPL), unified inelastic strain formulation by Anand, and unified visco-plastic model proposed by Chaboche. Their accuracies in predicting of the acceleration factor between the different temperature profiles are summarized and discussed.
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Authors
M. Kuczynska, N. Schafet, U. Becker, R. Metasch, M. Roellig, A. Kabakchiev, S. Weihe,