Analytical model for the transient analysis of electronic assemblies subjected to impact loading

This paper presents an analytical solution for the electronic assembly subjected to shock loading transient analysis problem. A previously published solution is adopted here and hence modified to solve for the transient solution. The results of this solution were thoroughly correlated with measurements and finite element analysis (FEA) data in terms of natural frequencies and mode shapes as well as solder axial deflections. Additionally, this solution was used to calculate axial stresses of the most-critical ball grid array (BGA) solder interconnect. Finally, a comprehensive study was carried out to investigate the effect of the assembly geometric and material parameters as well as loading conditions on the solder stresses and related that to the reliability performance of electronic devices subjected to shock and impact loadings.