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Improving ICs reliability with high speed thermal mapping

Article ID Journal Published Year Pages File Type
11020967 Integration, the VLSI Journal 2018 9 Pages PDF
Keywords
Thermal analysisFailure analysisThermographyReliabilityFault modeling
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
Preview
Improving ICs reliability with high speed thermal mapping
Authors
S. Panarello, C. Triolo, F. Garescì, S. Patanè, R. Denaro,
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Integration, the VLSI Journal
Journal: Integration, the VLSI Journal
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