Article ID Journal Published Year Pages File Type
4971433 Microelectronics Reliability 2017 10 Pages PDF
Abstract
This paper presents an extensive numerical analysis of the thermal behavior of InGaP/GaAs HBTs for handset applications in a laminate (package) environment. Both wire-bonding and flip-chip technologies are examined. The combination between an accurate, yet fast, simulation capability and the Design of Experiments technique is employed to quantify the impact of all the key technology parameters and explore a wide range of operating conditions.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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