Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
4971643 | Microelectronics Reliability | 2017 | 6 Pages |
Abstract
We investigate the effect of three testing conditions (thermal shock, Rapid Temperature Change - RTC - and high temperature storage) on the interconnects of a power electronic module. In particular, the mechanical strength of thick aluminium wirebonds is investigated and shows that while it is not affected by storage at 230 °C, it is much more sensitive to thermal cycling. Shock tests are found to be especially severe, despite having a smaller temperature swing than RTC. Regarding the die attach, no noticeable reduction in mechanical strength is found, regardless of the ageing conditions, and despite clear micro-structural evolutions.
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Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Wissam Sabbah, Faical Arabi, Oriol Avino-Salvado, Cyril Buttay, Loïc Théolier, Hervé Morel,