Multilevel logic and thermal co-simulation

This paper presents a logi-thermal simulation framework that allows to couple logic simulators and thermal solver engines to facilitate the co-simulation of high level functional and thermal behavior of digital circuits, both on gate level and register-transfer level. We show examples by integrating SystemC with the thermal simulator SUNRED, and comparing the results of a gate level logi-thermal simulation and logi-thermal simulation obtained with the register-transfer level description of the same system.