| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 547169 | Microelectronics Journal | 2014 | 6 Pages |
Abstract
This paper discusses the problem of thermal coupling in many-core processors manufactured in non-planar FinFET technologies. Our work focuses on two research goals. Firstly, the results obtained from the thermal simulations allow the investigation of mutual thermal influence between neighboring cores in such processors, what can be used to develop thermal models of such architectures. Secondly, we describe a test integrated circuit designed specifically to mimic the thermal behavior of microprocessors manufactured in various technologies. In particular, this paper describes its design and presents selected simulation results obtained using Green׳s function-based thermal software.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
M. Szermer, M. Janicki, P. Zajac, L. Kotynia, M. Jankowski, A. Napieralski,