Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
547650 | Microelectronics Journal | 2012 | 5 Pages |
This paper deals with the verification of thermal transient evaluation implementations. This subject is relevant because e.g. the upcoming standard will describe the thermal transient measurement as a standard method to estimate the junction-to-case thermal resistance [1] and [2], thus anybody can create their own implementation of the evaluation method. We have to have a method to verify these implementations. For this reason we examined the result of the NID (Network Identification by Deconvolution) method from different aspects. For these examinations we defined a multilayer structure as a reference structure and we analytically expressed the unit-step response and the cumulative structure function of this structure. Using the unit-step response as an input data set for the implementation in question we got an approximation of the structure function. Analysing this and the reference RC network we could define a practical maximum tolerance for the deviation between the analytical and the calculated functions.