Article ID Journal Published Year Pages File Type
547650 Microelectronics Journal 2012 5 Pages PDF
Abstract

This paper deals with the verification of thermal transient evaluation implementations. This subject is relevant because e.g. the upcoming standard will describe the thermal transient measurement as a standard method to estimate the junction-to-case thermal resistance [1] and [2], thus anybody can create their own implementation of the evaluation method. We have to have a method to verify these implementations. For this reason we examined the result of the NID (Network Identification by Deconvolution) method from different aspects. For these examinations we defined a multilayer structure as a reference structure and we analytically expressed the unit-step response and the cumulative structure function of this structure. Using the unit-step response as an input data set for the implementation in question we got an approximation of the structure function. Analysing this and the reference RC network we could define a practical maximum tolerance for the deviation between the analytical and the calculated functions.

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Physical Sciences and Engineering Computer Science Hardware and Architecture
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