| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6945648 | Microelectronics Reliability | 2018 | 11 Pages |
Abstract
The presence of components inside the enclosure damps the response of the internal climate to the ambient changes and this is especially the case for the aluminum heatsink. In case of exposure to RH of 100%, controlling the moisture concentration appears to be more effective than controlling temperature with the aim of reducing the condensation risk on the PCB.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Parizad Shojaee Nasirabadi, Jesper Henri Hattel,