Article ID Journal Published Year Pages File Type
6946141 Microelectronics Reliability 2017 10 Pages PDF
Abstract
This paper presents three procedures for the extraction of parametric Dynamic Compact Thermal Models (DCTMs) with controlled and user-chosen accuracy, namely, (i) a DCTM with dense matrices obtained by a direct conventional method, (ii) a partition-based approach leading to a sparse DCTM suited for heat conduction problems suffering from a massive number of independent heat sources and/or parameters, for which extracting conventional dense DCTMs may be too resource-demanding or even unviable, and (iii) a novel algorithm that quickly translates a sparse DCTM into a dense one, which allows reducing the simulation time. The proposed methodologies are validated through the application to two state-of-the-art electronics systems.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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