Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10364813 | Microelectronic Engineering | 2005 | 6 Pages |
Abstract
Pre-amorphization implantation has been applied as a shallow junction technology. Roughness at amorphous/crystalline (a/c) interface should be controlled to improve junction characteristics. To understand and model a/c interface roughness, molecular dynamic method is applied in simulating pre-amorphization implantation. A method to reproduce roughness at a/c interface by molecular dynamic simulation is presented. A model of interface roughness is presented. Si and Ge implantation from 2-20Â keV at a dose of 1Â ÃÂ 1015Â cmâ2 is simulated. The depth of a/c interface is reproduced. Experimental results of a/c interface roughness are successfully simulated. The interface roughness is well reproduced and interpreted by the model presented.
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Authors
Min Yu, Rong Wang, Huihui Ji, Ru Huang, Xing Zhang, Yangyuan Wang, Jinyu Zhang, Hideki Oka,