Exploiting the combination of 3D polymer printing and inkjet Ag-nanoparticle printing for advanced packaging

•The combination of 3D polymer printing and Ag nanoparticle printing for rapid advanced packaging concept is proposed.•The 3D polymer package housing with the Ag antenna structure is successfully connected with the SAW chip via flip-chip technique.•The signal to noise ratio of about 30 dB via antenna-bridge radio frequency link confirms a stable and efficient SAW package prototype design.

A rapid advanced packaging concept, consisting of 3D photopolymer printing and Ag nanoparticle printing, was investigated for the construction of a simple radio frequency identification (RFID) package with integrated surface acoustic wave transponder (SAW). An acrylate-type SAW package housing was printed with a multi-jet 3D printer and the corresponding antenna for the wireless read-out was manufactured via inkjet printing of Ag nanoparticle ink. The corresponding Ag structure had a thickness of about 2 μm with a sheet resistance of 250 mΩ sq− 1 after the photonic sintering processing. The chip-on-board and flip-chip packaging concepts were pursued for connecting the antenna structure to the chip pads. The SAW package prototype in a flip-chip configuration showed a significant signal to noise ratio (SNR) of about 30 dB via antenna-bridged radio frequency link at a moderate distance of 3 cm.

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