Characterization of signal transfer performance of a through glass via (TGV) substrate with silicon vertical feedthroughs

This figure shows the schematic view and key fabrication process of the TGV substrate with a micro silicon resonator. The glass interposer surrounding the silicon vertical feedthroughs is formed by double-side glass reflow process in which the melted glass fills into the silicon mold. A cavity for the vibration of the silicon resonator is realized by etching the refilled glass, and then metal electrodes are formed in the cavity. The bonding interface is filled with refilled glass, which enables the resonator to be anodically bonded to the TGV substrate. In this way, parallel plate capacitor is formed between the resonator and the electrodes, and then the resonator can be excited by capacitive transduction.252