| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 539016 | Microelectronic Engineering | 2016 | 7 Pages |
•An analytical model of TGV was developed to enhance the performance of interconnections in 3D packages.•The analytical models represent the thermal stress in terms of different geometrical parameters.•Three dimensional Finite Element Models were carried out in order to simulate the thermal stresses.•The meshing size and boundary condition were carefully selected and applied to get accurate results out of simulations.•A side by side comparison of the analytical model and finite element results showed an agreement.
This paper presents a thermomechanical study of the stresses which eventually occur in through glass vias (TGVs) due to the coefficient of thermal expansion (CTE) mismatch. The objective of the analysis is to assess the thermal stress variations in TGVs of different geometries. The main contribution of this paper is the elaboration of mathematical models to describe the thermomechanical stress in TGVs. To validate these models, a comparison with a linear finite element analysis (FEA) is carried out. The findings can be used to improve the reliability and engineering design in three-dimensional microelectronic packaging.
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