Tin assisted transfer of electroplated metal nanostructures and its application in flexible chiral metamaterials

A novel method named tin-assisted transfer of nanoscale electroplated metal structures was introduced for the fabrication of flexible devices. With the addition of a tin releasing layer, electroplated metal structures, which were achieved on rigid substrates using a combination of electron beam lithography and electroplating, were successfully transferred to flexible substrates. Using this method, various metal (Ag, Au, and Pt) structures were patterned onto flexible substrates. To demonstrate the utility of this process for fabrication of flexible devices, a mid-infrared flexible metamaterial with chiral structures was successfully produced.

Graphical abstractFigure optionsDownload full-size imageDownload as PowerPoint slideHighlights► A tin layer was introduced for transfer of electroplated metal structures. ► Electroplated Ag, Au, and Pt structures were transferred to flexible substrates. ► A flexible mid-infrared metamaterial comprised of chiral structures was prepared.