| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 539405 | Microelectronic Engineering | 2014 | 7 Pages |
•Template releasing simulation based on fracture mechanics is firstly done.•The behavior of the template releasing is well explained and agree to the experimental result.•Dependence on aspect ratio and the thickness of the residual layer are discussed.
The template release process in nanoimprint lithography was simulated based on fracture mechanics and the mechanism of release was elucidated. The template release was found to start with the separation from the residual layer with separation then propagating along the sidewall of the template toward the top surface. After separation, the template was removed. The effect of the release load on the energy release rates for the opening mode (mode I) and in-plane shearing mode (mode II) were qualitatively investigated to verify the influence of the adhesive characteristics between the resist and the template. Finally, the effects of the residual layer thickness and the modulus of the resist were investigated.
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