| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 539650 | Microelectronic Engineering | 2011 | 4 Pages |
Abstract
The creep-rupture lives of Sn3.8Ag0.7Cu and Sn3.8Ag0.7Cu0.03Ce lead-free solder joints for electronic packaging were investigated, respectively. And the relationship between creep behavior and intermetallic compound (IMC: Ag3Sn, Cu6Sn5, CeSn3) particles in SnAgCu/SnAgCuCe solder joints has been obtained. Meanwhile, rare earth Ce concentration gradient and retardation effect of Ce on the IMC layer have been observed at the solder/Cu interface. Moreover, aging reaction of Sn and Cu, and the effect mechanism of rare earth Ce on two IMCs (Cu6Sn5 and Cu3Sn) are reported.
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Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Liang Zhang, Song-bai Xue, Li-li Gao, Wei Dai, Feng Ji, Yan Chen, Sheng-lin Yu,