Article ID Journal Published Year Pages File Type
539672 Microelectronic Engineering 2011 7 Pages PDF
Abstract

Electrically conductive silver nanoparticle ink patterns were fabricated using the inkjet printing method. Two different polymer films were used as the substrate materials. The patterns were exposed to humidity and salt fog and the electrical performance (sheet resistance and RF performance) as well as mechanical endurance (adhesion) were measured before and after the environmental tests. The electrical properties of the printed structures remained good in all the measurable samples. The adhesion between the ink and a substrate material appeared to be a greater challenge in harsh environments. Protection capabilities of one dip coated and one hot laminated barrier materials were evaluated during the environmental tests. The results showed that there is a need for environmental protection in printed electronics. Especially the laminated barrier films can offer a potential solution for shielding printed electronics in harsh environments as they can provide good mechanical protection, and can easily be integrated in roll-to-roll process.

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Physical Sciences and Engineering Computer Science Hardware and Architecture
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