Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
539880 | Microelectronic Engineering | 2010 | 5 Pages |
Abstract
During first metal level interconnects fabrication, a controlled modification of the electro-deposited copper over-deposition (overburden) is performed using a partial chemical–mechanical polishing (CMP) step. Next, copper microstructure is stabilized with a short duration hot-plate anneal. Overburden is then removed during CMP end-of-step. Ionic microscopy and EBSD observations of overburden thickness reduction reveal that copper grain growth occurs differently, according to patterned geometries and with a strong 〈1 1 1〉 texture, as observed in modified films. Reduction of overburden thickness also reveals the capacity of anneal temperature to impact electrical performances. Reliability is impacted for thinnest wires.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
O. Dubreuil, V. Caubet-Hilloutou, J. Guillan, K. Haxaire, M. Mellier, P. Caubet, P. Vannier, E. Petitprez, D. Bellet, Ph. Normandon,