Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
539928 | Microelectronic Engineering | 2007 | 4 Pages |
Abstract
The change in the thickness and chemical states of the interfacial layer and the related electrical properties in Ta2O5 films with different annealing temperatures were investigated. The high-resolution transmission electron microscopy and X-ray photoelectron spectroscopy analyses revealed that the 700 °C-annealed Ta2O5 film remained to be amorphous and had the thinnest interfacial layer which was caused by Ta-silicate decomposition to Ta2O5 and SiO2. In addition, the electrical properties were improved after annealing treatments. Our results suggest that an annealing treatment at 700 °C results in the highest capacitance and the lowest leakage current in Ta2O5 films due to the thinnest interfacial layer and non-crystallization.
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Authors
Jae-Woong Lee, Moon-Ho Ham, Wan-Joo Maeng, Hyungjun Kim, Jae-Min Myoung,