Article ID Journal Published Year Pages File Type
540093 Microelectronic Engineering 2007 4 Pages PDF
Abstract

The individual steps in fabrication of templates for UV-NIL processes are described. After spin coating a conductive copolymer (ESPACER 300) on top of the resist, insulating substrates have been structured by use of electron beam lithography at 20 keV beam energy. A three-dimensional (3D) pattern has been created in a low contrast positive tone resist PMMA 35k. By RIE in a CHF3 – O2 – process, the pattern has been transferred into the quartz substrate. Finally, the 3D structures have been replicated in a UV-NIL process.

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