Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
540093 | Microelectronic Engineering | 2007 | 4 Pages |
Abstract
The individual steps in fabrication of templates for UV-NIL processes are described. After spin coating a conductive copolymer (ESPACER 300) on top of the resist, insulating substrates have been structured by use of electron beam lithography at 20 keV beam energy. A three-dimensional (3D) pattern has been created in a low contrast positive tone resist PMMA 35k. By RIE in a CHF3 – O2 – process, the pattern has been transferred into the quartz substrate. Finally, the 3D structures have been replicated in a UV-NIL process.
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Authors
Guido Piaszenski, Ulrich Barth, Axel Rudzinski, Andreas Rampe, Andreas Fuchs, Markus Bender, Ulrich Plachetka,