Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
540432 | Microelectronic Engineering | 2008 | 5 Pages |
Abstract
A new ultraviolet assisted nanoimprint lithography technique with an exposure through non-transparent molds and a nm-resolution capability is reported. The UV imprint material was not cured by direct irradiation, but substantially exposed to indirect and diffuse irradiation. The nanoimprint molds consisted of a transparent support and a non-transparent, patterned element. Successful imprints were conducted on transparent glass and polymer foils placed on non-transparent substrate holders as well as on SiO2 on Si. The reported technique enables the application of non-transparent mold materials like Si, new mold materials and alternative antisticking layers like metals in UV-NIL.
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Physical Sciences and Engineering
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Authors
R. Kirchner, A. Finn, L. Teng, M. Ploetner, A. Jahn, L. Nueske, W.-J. Fischer,