| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 540842 | Microelectronic Engineering | 2007 | 6 Pages |
Abstract
The Field Emission Display (FED) is one of the most promising flat panel displays for the future. Currently this has been demonstrated using Very Large Scale Integrated circuit (VLSI) thin film technology to manufacture the key component of the FED, which is the Spindt type molybdenum micro-cone-shape field emitters. These are normally produced on glass or silicon substrates. In this paper, a new approach has been successfully developed to fabricate micro-field emitters on ceramic substrates. The significance of this development is that it provides the possibility to integrate small size FEDs into large dimensions.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
L. Chen, M.M. El-Gomati,