| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 541314 | Microelectronic Engineering | 2014 | 4 Pages |
•Conventional EM fWLR EM tests suffer from strong temperature inhomogeneities.•As a consequence these tests tend to cause erroneous lifetimes.•A new EM fWLR test system is presented.•It reliably eliminates via/line temperature inhomogeneities for the first time.•For any quantitative assessments temperature homogeneity is mandatory.
Electromigration fWLR tests lack validity because of unresolved temperature inhomogeneities in the test structures. A new system quantifies the undesirable impact of temperature inhomogeneities on lifetime results and demonstrates that temperature gradients can be completely avoided for any process/material change or process instability in any common technology.
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