| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 541387 | Microelectronic Engineering | 2011 | 7 Pages |
The impact of fluoride and AlOx contaminants on the quality of wire bonding (Au to Al welding) has been measured. No or minor impact of these contaminants has been found with a standard ball shear test. Despite an accelerated lifetime test, the shear strength remains above the required specification limits. Intermetallic coverage, the percentage of the interface between the bond ball and the bond pad where welding resulted in intermetallic diffusion, gives a better picture of the quality decay, but this method is too elaborate for production control and specification limits are unclear.
Graphical abstractFigure optionsDownload full-size imageDownload as PowerPoint slideResearch highlights► Contamination of aluminum bond pads with fluoride or oxide layers have no or minor impact on the gold wire bond quality indicator, i.e. ball shear test. ► In accelerated lifetime test, this quality indicator remains within specification. ► Closer optical inspection of the aluminum gold weld shows that intermetallic formation was not formed over the full contact area.
