Fabrication of organic flexible electrodes using transfer stamping process

A transfer stamping process is proposed to fabricate micro-scale organic flexible electrodes. With different adhesion forces of the transferring interfaces, ink/mold and ink/substrate, patterns are formed from the relief features of the elastomeric mold to the substrate without residual layer, and no complex pre-process and steps are needed. To estimate the deformation during pressing, the sagging height of the mold is analyzed with finite element method (FEM). Two conductive polymers, PEDOT:PSS and silver paste, are transferred from the flat relief features of the mold to the PET substrate. The coating characteristics and problems are discussed. The transfer stamping process is also employed to fabricate electrodes on the dielectric/ITO film and to form an organic flexible capacitance. This paper demonstrates the potential of transfer stamping in fabricating organic electronic components, such as organic integrated circuit, OLED and OTFT.