Durability of antisticking layer against heat in nanoimprinting evaluated using scanning probe microscopy

In nanoimprint lithography (NIL), a mold is coated with an antisticking layer for preventing resin from adhering to it. A fluorinated self-assembled monolayer (F-SAM) is mainly used as the antisticking layer. The temperature of the mold in thermal NIL increases around the glass transition temperature of the resin. It is therefore important to assess the durability of the antisticking layer against heat. We evaluated the releasing effect of F-SAMs with and without annealing by using measurements obtained from the surface free energy and scanning probe microscopy (SPM). Furthermore, we examined the surface chemical composition and the surface morphology of F-SAMs with and without annealing using X-ray photoelectron spectroscopy (XPS), Fourier transform infrared spectroscopy (FT-IR), and atomic force microscopy (AFM). From these results, we confirmed that the releasing effect of F-SAM deteriorated due to thermal decomposition when annealing over 500 °C. However, we found that F-SAMs annealed at 500 °C had a sufficiently large releasing effect in nanoimprinting.