Article ID Journal Published Year Pages File Type
541563 Microelectronic Engineering 2009 4 Pages PDF
Abstract

Pattern doubling by cross-linking of a spacer triggered by residual acid diffusion from a previously developed primary structure into the spacer is a possible option to create the necessary structure widths for the 32 nm node with current exposure technology by pattern doubling. A particular advantage of this process step would be the self-alignment to the primary structure, which would render a second exposure step unnecessary. In the paper, we present a new prototypical model of the bake step of this process and discuss the dependency of the desired behavior on parameters of the model.

Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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