Article ID Journal Published Year Pages File Type
541765 Microelectronic Engineering 2007 6 Pages PDF
Abstract

High surface area Si/Al2O3/ZnO:Al capacitors were formed in electrochemically etched porous silicon. The Al2O3 dielectric and the ZnO:Al top electrode were deposited by atomic layer deposition in high aspect ratio porous Si. A single capacitor with a typical area of about 1 mm2 consisted of about 105 pores. Effective capacitance densities were between 2.0 and 2.5 μF/cm2, i.e., approximately 30 times higher than for a planar capacitor prepared under identical conditions, illustrating the effect of the enhanced surface area in the porous structure.

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