Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
541765 | Microelectronic Engineering | 2007 | 6 Pages |
Abstract
High surface area Si/Al2O3/ZnO:Al capacitors were formed in electrochemically etched porous silicon. The Al2O3 dielectric and the ZnO:Al top electrode were deposited by atomic layer deposition in high aspect ratio porous Si. A single capacitor with a typical area of about 1 mm2 consisted of about 105 pores. Effective capacitance densities were between 2.0 and 2.5 μF/cm2, i.e., approximately 30 times higher than for a planar capacitor prepared under identical conditions, illustrating the effect of the enhanced surface area in the porous structure.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Marianna Kemell, Mikko Ritala, Markku Leskelä, Emmanuel Ossei-Wusu, Jürgen Carstensen, Helmut Föll,