| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 541909 | Microelectronic Engineering | 2006 | 5 Pages |
Abstract
This paper describes a simple and novel approach to calculate the line resistance of copper interconnects. The proposed methodology is simply based on a linear representation of the Cu resistivity vs. 1/SCu (SCu is the Cu cross-sectional area) in which the slope captures the net result of scattering phenomena in Cu.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Y. Travaly, M. Bamal, L. Carbonell, F. Iacopi, M. Stucchi, M. Van Hove, G.P. Beyer,