| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 541929 | Microelectronic Engineering | 2006 | 9 Pages |
Abstract
Cylindrical substrates offer a unique geometry for microfabrication processing. This paper describes methods for depositing and removing materials from cylinders ranging in diameter from 85 μm to 3000 μm. Rotary-sputtered thin films are shown to have predictable deposition rates and excellent longitudinal and radial uniformity. Dip-coated films suffer from low radial uniformity and must be individually characterized to predetermine the film thickness applied for a given withdrawal rate. Etch processes display predictable etch rates similar to those for planar substrates.
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Authors
Sean Snow, Stephen C. Jacobsen,