| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 542749 | Microelectronic Engineering | 2014 | 6 Pages |
•Porous alumina-g-polystyrene sulfonic acid (Al2O3-g-PSS) abrasive was prepared.•Porous Al2O3-g-PSS has better dispersibility than porous or solid alumina abrasives.•Porous Al2O3-g-PSS shows lower roughness and topographical variations in polishing.
Porous alumina-g-polystyrene sulfonic acid (Al2O3-g-PSS) was prepared by surface activation, graft polymerization and sulfonation, successively. Fourier transform infrared spectroscopy (FTIR), time of flight-secondary ion massspectroscopy (TOF-SIMS), scanning electron microscopy (SEM), and transmission electron microscope (TEM) analyses showed that the polystyrene sulfonic acid had grafted to the surface of porous alumina, and the prepared porous Al2O3-g-PSS abrasive had porous structure and good dispersibility. The chemical mechanical polishing (CMP) performances of the porous Al2O3-g-PSS abrasive on hard disk substrates were investigated. The results showed that, the surface of hard disk polished by the porous Al2O3-g-PSS abrasive had lower topographical variations and surface roughness (Ra) than those polished by pure porous alumina and solid alumina abrasives.
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