Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
542872 | Microelectronic Engineering | 2013 | 4 Pages |
Abstract
The present paper deals with the formation of high conductivity through silicon via from macroporous silicon arrays. The through wafer macropores were first etched by anodization into a hydrofluoric acid – ethanol mixture. The conditions of straight and ordered macropore etching were studied. The high aspect ratio (18) and high density via (above 105/cm2) were then filled by copper using an optimized potentiostatic technique involving a specific electrolyte with additives. The copper micro-wires were observed by SEM whereas XRD analysis enabled the determination of the average grain size.
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Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
T. Defforge, L. Coudron, O. Ménard, V. Grimal, G. Gautier, F. Tran-Van,