| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 543079 | Microelectronic Engineering | 2010 | 6 Pages |
In this work, we prepared metal/interlayer/semiconductor (MIS) diodes by coating of an organic film on p-Si substrate. Metal(Al)/interlayer(Orange GOG)/semiconductor(p-Si) MIS structure had a good rectifying behavior. By using the forward-bias I–V characteristics, the values of ideality factor (n) and barrier height (BH) for the Al/OG/p-Si MIS diode were obtained as 1.73 and 0.77 eV, respectively. It was seen that the BH value of 0.77 eV calculated for the Al/OG/p-Si MIS diode was significantly larger than the value of 0.50 eV of conventional Al/p-Si Schottky diodes. Modification of the potential barrier of Al/p-Si diode was achieved by using thin interlayer of the OG organic material. This was attributed to the fact that the OG organic interlayer increased the effective barrier height by influencing the space charge region of Si. The interface-state density of the MIS diode was found to vary from 2.79 × 1013 to 5.80 × 1012 eV−1 cm−2.
