Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
543080 | Microelectronic Engineering | 2010 | 7 Pages |
Abstract
Electroplating of copper is widely used for the fabrication of interconnections of printed circuit boards, in which via-holes are used to connect conductive layers. Self-annealing is an important feature of electroplated copper which significantly alters its microstructures. The degradation of 〈1 1 0〉 texture and the enhancement of 〈3 1 1〉 texture in electroplated copper during self-annealing process are observed by X-ray diffraction (XRD) and electron backscattering diffraction (EBSD). The mechanism of this transformation is discussed and illustrated.
Keywords
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Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
W.Q. Zhang, A.D. Li, G.B. Ma, K.B. Yin, Y.D. Xia, Z.G. Liu, C.Y. Chan, K.L. Cheung, M.W. Bayes, K.W. Yee,