Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
543182 | Microelectronic Engineering | 2010 | 5 Pages |
The influence of different polymerization conditions like curing agent (MEKP) amount and styrene content on the glass transition temperature, the relative dielectric constant as well as loss factors of unsaturated polyester–styrene-polymer systems after solidification was investigated in depth. With respect to a high average molecular mass and Vickers hardness a curing agent content of 3 wt% is recommendable. Increasing MEKP-concentrations cause a slight elevation of the polymers relative dielectric constant as well as of the loss factor. Regarding an easy film formation using tape casting a.o. higher styrene amounts lower the viscosity of the resin significantly, the relative dielectric constant and the loss factor decrease also. As an average value a relative dielectric constant of 3 under ambient conditions can be obtained.