Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
543382 | Microelectronic Engineering | 2009 | 4 Pages |
Abstract
This paper gives a brief overview of some of the challenges and approaches of integration of high dielectric constant (high-κ) dielectrics with compound semiconductor materials for future high performance low power logic applications. Reviewed themes include interface passivation layer, atomic layer deposition self-cleaning effects and characterization of dielectric/III–V interfaces.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
W. Tsai, N. Goel, S. Koveshnikov, P. Majhi, W. Wang,