Effect of high-temperature annealing on lanthanum aluminate thin films grown by ALD on Si(1 0 0)

Amorphous lanthanum aluminate thin films were deposited by atomic layer deposition on Si(1 0 0) using La(iPrCp)3, Al(CH3)3 and O3 species. The effects of post-deposition rapid thermal annealing on the physical and electrical properties of the films were investigated. High-temperature annealing at 900 °C in N2 atmosphere leads to the formation of amorphous La-aluminosilicate due to Si diffusion from the substrate. The annealed oxide exhibits a uniform composition through the film thickness, a large band gap of 7.0 ± 0.1 eV, and relatively high dielectric constant (κ) of 18 ± 1.